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[Remote] R-10060931 System IC Architect - Advanced Power Systems
Note: The job is a remote job and is open to candidates in USA. NXP Semiconductors is seeking a visionary System IC Architect with deep expertise in system-level architecture and high-performance power conversion. This role is pivotal in defining next-generation Point of Load (PoL) solutions, driving innovation in advanced power management with System-in-Package (SiP) integration.
Responsibilities
- Own System IC Architecture, to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions
- Develop and maintain long-term product and technology roadmaps in collaboration with product line leaders and R&D teams
- Translate customer requirements into innovative packaging and power management solutions. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions
- Support development through thermal optimization and electrical analysis
- Partner with system solution architects and IC product architects to ensure solutions meet stringent performance, efficiency, space, and cost targets
- Lead integration of ICs and power semiconductors into advanced packages and systems. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions. Expertise in System-in-Package (SiP) integration is essential
- Drive early-phase engineering and architecture for AI compute, automotive 48V systems, and electrification platforms. Knowledge of AI Compute Power Solutions is critical. Automotive Power Management experience is a plus, highly valued
- Analyze customer-specific needs to deliver optimized power efficiency and thermal management strategies for enhanced reliability. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions
- Collaborate with system, modeling, design, packaging and manufacturing engineering teams to validate and optimize high-performance compute Power designs
- Act as a technical liaison with customers, supporting co-development and design-in activities
- Provide strategic insights on state-of-the-art power management technologies and benchmark readiness. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions
- Report KPIs and project status to executive stakeholders
Skills
- Deep expertise in system-level architecture, high-performance power conversion, and semiconductor packaging technologies
- Ability to define products, shape architecture strategy, and support the launch of Point-of-Load (PoL) power solutions
- Expertise in AI compute power
- Experience in automotive power management
- Ownership of System IC Architecture to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions
- Development and maintenance of long-term product and technology roadmaps in collaboration with product line leaders and R&D teams
- Translation of customer requirements into innovative packaging and power management solutions
- Support development through thermal optimization and electrical analysis
- Partnership with system solution architects and IC product architects to ensure solutions meet performance, efficiency, space, and cost targets
- Leadership in integration of ICs and power semiconductors into advanced packages and systems
- Driving early-phase engineering and architecture for AI compute, automotive 48V systems, and electrification platforms
- Analysis of customer-specific needs to deliver optimized power efficiency and thermal management strategies
- Collaboration with system, modeling, design, packaging and manufacturing engineering teams to validate and optimize high-performance compute Power designs
- Acting as a technical liaison with customers, supporting co-development and design-in activities
- Providing strategic insights on state-of-the-art power management technologies and benchmark readiness
- Reporting KPIs and project status to executive stakeholders
- Master's degree in Power Electronics, Electrical Engineering, or related field (Ph.D. preferred)
- 15+ years of experience in power semiconductors, packaging, and system-level integration
- Proven track record in product definition through revenue realization
- Strong expertise in thermal management, electrical performance, and advanced reliability
- Proficiency in circuit simulation tools (e.g., Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, Verilog-AMS) and knowledge of PCB materials and stack-up
- Experience in Powering high performance compute SoC platforms, with automotive-grade standards highly valued
- Experience in systems developed according to Functional Safety standard is a plus (ISO26262 and/or IEC61508)
- Demonstrated ability to lead cross-functional, global teams and manage complex projects
- Excellent communication and interpersonal skills; ability to collaborate across diverse teams
- Creative mindset with strong problem-solving capabilities
- Willingness to travel globally
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